China says US plan to toughen semiconductor curb will backfire

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A central processing unit (CPU) semiconductor chip is displayed among flags of China and U.S., in this illustration picture taken February 17, 2023. REUTERS
BEIJING, Feb 25 (Reuters) – The U.S. plan of coercing other countries into going after China’s semiconductor industry will backfire, China’s foreign ministry said on Tuesday.
Such actions by the United States will hinder development of the global semiconductor industry, said Lin Jian, a foreign ministry spokesperson, in a regular press briefing, when asked about the White House’s plan to toughen semiconductor restrictions on China.

Reporting by Colleen Howe and Xiuhao Chen; Editing by Tom Hogue

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